Inventor
YUSUKE ISHIYAMA
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
B23KSoldering or unsoldering8%
C22CAlloys8%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems8%
H05KPrinted circuits8%
PatentTitleYear
11,557,531Semiconductor device with metal film, power conversion device with the semiconductor device, and method of manufacturing the semiconductor device202311,424,178Semiconductor module202211,398,447Semiconductor device and method for producing semiconductor device202211,322,452Semiconductor module2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to MITSUBISHI ELECTRIC CORP (4)· patent assignee history
2022–2023Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 4 | 2022–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2022–2023 |