Inventor
Ikuko Ishii
Inventor
Tokyo, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Kprimary
H10KOrganic electric solid-state devices30%
H05BElectric heating26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
Y10TTechnical subjects covered by former us classification9%
G02BOptical elements, systems or apparatus4%
H01JElectric discharge tubes or discharge lamps4%
PatentTitleYear
7,224,119'Device package with a thermoplastic encapsulation cap and device encapsulation method'20076,929,523'Device package with hermetically sealed cap and device encapsulation method'20056,828,728'Device package with hermetically sealed cap'20046,706,425'Organic EL panel and filter for same'20046,677,620'Organic EL element and method of manufacturing the same'20046,551,724'Organic electro-luminescent display panel'20036,520,821'Device package and device encapsulation method'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2004Patents assigned to NEC CORP (4)· patent assignee history
2003–2007Based in Tokyo, JP· patent location history
2004–2007Patents assigned to SAMSUNG SDI CO LTD (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEC CORP | 4 | 2003–2004 |
| SAMSUNG SDI CO LTD | 3 | 2004–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 7 | 2003–2007 |