Inventor

Hidetaka Sato

Inventor

Hitachi, JP

Overview

22→

Patents

1977–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C08Gprimary

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds14%

H01BCables13%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%

C08LCompositions of macromolecular compounds5%

H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems5%

H05BElectric heating5%

H05KPrinted circuits5%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

H02KDynamo-electric machines3%

Y10TTechnical subjects covered by former us classification3%

PatentTitleYear

10,286,753On-state malfunction detection device and method therefor2019 9,923,364'Load driving device, vehicle air-conditioning apparatus, and load short-circuit protection circuit'2018 9,351,343'Heater control device, and control method and control program for heater control device'2016 9,198,231'Heater control device, method and program'2015 9,115,707'Inverter module and integrated-inverter electric compressor using the same'2015 9,059,620'Inverter and integrated-inverter electric compressor'2015 6,274,834'Push-button switch with part to a wire rod exposed to an inside bottom of housing to form a contact portion'2001 5,837,804'Polyimides and optical parts obtained by using the same'1998 5,537,307'Control device for system interconnection inverter'1996 5,226,928'Reforming apparatus for hydrocarbon'1993 5,165,957'Process for producing multilayer wiring structure'1992 5,164,816'Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste'1992 5,132,386'Insulating resin composition and semiconductor device using the same'1992 5,087,658'Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste'1992 4,958,001'Dicyclohexyl-3,4,3\',4\'-tetracarboxylic acid or dianhydride thereof and polyamide-acid and polyimide obtained therefrom'1990 4,758,476'Polyimide precursor resin composition and semiconductor device using the same'1988 4,645,688'Composition for protective coating material'1987 4,511,705'Composition for protective coating material'1985 4,497,922'Compositions of materials for forming protective film in semiconductor device'1985 4,338,426'Intermediate, copolymer resin and production thereof'1982 4,233,413'Resin composition with low shrinkage'1980 4,059,904'Preparation of coating composition of specified color'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1980–1998Patents assigned to HITACHI CHEMICAL CO LTD (12)· patent assignee history

1980–1998Based in Hitachi, JP· patent location history

1993–2016Based in Tokyo, JP· patent location history

1996Based in Ichihara, JP· patent location history

2001Based in Miyagi, JP· patent location history

2015–2016Patents assigned to SATO HIDETAKA (4)· patent assignee history

2015–2018Patents assigned to MITSUBISHI HEAVY IND AUTOMOTIVE THERMAL SYS CO LTD (3)· patent assignee history

2015–2016Patents assigned to NAKANO KOJI (3)· patent assignee history

2015–2016Patents assigned to KOMINAMI SATOSHI (2)· patent assignee history

2015–2019Based in Aichi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI CHEMICAL CO LTD	12	1980–1998
SATO HIDETAKAself	4	2015–2016
MITSUBISHI HEAVY IND AUTOMOTIVE THERMAL SYS CO LTD	3	2015–2018
NAKANO KOJI	3	2015–2016
KOMINAMI SATOSHI	2	2015–2016

Locations

Location	Patents	Span
Hitachi, JP	11	1980–1998
Tokyo, JP	4	1993–2016
Aichi, JP	3	2015–2019
Miyagi, JP	1	2001
Ichihara, JP	1	1996