Inventor
Akihiko Hatasawa
Inventor
Tokyo, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
PatentTitleYear
10,734,322Through-holes of a semiconductor chip202010,475,746Through-holes of a semiconductor chip201910,115,693Solder layer of a semiconductor chip arranged within recesses20187,928,551'Semiconductor device and method of manufacturing the same'20117,372,130'Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement'20087,321,165'Semiconductor device and its manufacturing method'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2011Patents assigned to ELPIDA MEMORY INC (3)· patent assignee history
2008Based in Akita, JP· patent location history
2011–2020Based in Tokyo, JP· patent location history
2018–2020Patents assigned to LONGITUDE LICENSING LTD (3)· patent assignee history
2018Patents assigned to PS4 LUXCO SARL (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ELPIDA MEMORY INC | 3 | 2008–2011 |
| LONGITUDE LICENSING LTD | 3 | 2018–2020 |
| PS4 LUXCO SARL | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 4 | 2011–2020 |
| Akita, JP | 2 | 2008 |