Inventor
Keum-Hee Ma
Inventor
Andong-si, KR
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H04NPictorial communication, e.g. television10%
A47GHousehold or table equipment6%
H01LSemiconductor devices6%
C25DProcesses for the electrolytic or electrophoretic production of coatings3%
E05YIndexing scheme associated with subclasses e05d and e05f, relating to construction elements, electric control, power supply, power signal or transmission, user interfaces, mounting or coupling, details, accessories, auxiliary operations not otherwise provided for, application thereof3%
E06BFixed or movable closures for openings in buildings, vehicles, fences or like enclosures in general, e.g. doors, windows, blinds, gates3%
PatentTitleYear
9,515,057'Semiconductor package and method of manufacturing the semiconductor package'20169,245,771'Semiconductor packages having through electrodes and methods for fabricating the same'20168,513,802'Multi-chip package having semiconductor chips of different thicknesses from each other and related device'20138,373,261'Chip stack package and method of fabricating the same'20138,183,673'Through-silicon via structures providing reduced solder spreading and methods of fabricating the same'20128,114,772'Method of manufacturing the semiconductor device'20127,777,323'Semiconductor structure and method for forming the same'20107,588,964'Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same'20097,534,656'Image sensor device and method of manufacturing the same'20097,524,763'Fabrication method of wafer level chip scale packages'20097,521,657'Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same'20097,459,774'Stacked chip package using photosensitive polymer and manufacturing method thereof'20087,371,614'Image sensor device and methods thereof'20087,300,864'Method for forming solder bump structure'20077,262,475'Image sensor device and method of manufacturing same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2016Patents assigned to SAMSUNG ELECTRONICS CO LTD (15)· patent assignee history
2007–2009Based in Andong-si, KR· patent location history
2008–2010Based in Andong, KR· patent location history
2012–2013Patents assigned to MA KEUM-HEE (4)· patent assignee history
2012–2013Patents assigned to YOON MIN-SEUNG (4)· patent assignee history
2012–2013Patents assigned to HWANG SON-KWAN (2)· patent assignee history
2012–2013Patents assigned to KIM NAM-SEOG (2)· patent assignee history
2012–2016Based in Suwon-si, KR· patent location history
2012Based in Gyeongsangbuk-do, KR· patent location history
2013Based in Gyeonggi-do, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 15 | 2007–2016 |
| MA KEUM-HEEself | 4 | 2012–2013 |
| YOON MIN-SEUNG | 4 | 2012–2013 |
| HWANG SON-KWAN | 2 | 2012–2013 |
| KIM NAM-SEOG | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Andong-si, KR | 7 | 2007–2009 |
| Suwon-si, KR | 4 | 2012–2016 |
| Andong, KR | 2 | 2008–2010 |
| Gyeonggi-do, KR | 1 | 2013 |
| Gyeongsangbuk-do, KR | 1 | 2012 |