Inventor
Wolfram Hable
Inventor
Neumarkt, DE
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
H01LSemiconductor devices30%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for8%
H05KPrinted circuits8%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems5%
Y10TTechnical subjects covered by former us classification5%
B60LPropulsion of electrically-propelled vehicles3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
Y02TClimate change mitigation technologies related to transportation3%
PatentTitleYear
10,615,097Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet202010,461,017Package with partially encapsulated cooling channel for cooling an encapsulated chip201910,283,432Molded package with chip carrier comprising brazed electrically conductive layers201910,128,165Package with vertically spaced partially encapsulated contact structures201810,079,195Semiconductor chip package comprising laterally extending connectors201810,074,590Molded package with chip carrier comprising brazed electrically conductive layers201810,037,972Electronic module comprising fluid cooling channel and method of manufacturing the same20189,589,922'Electronic module and method of manufacturing the same'20179,585,241'Substrate, chip arrangement, and method for manufacturing the same'20179,397,018'Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit'20169,362,193'Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit'20169,275,926'Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip'20167,592,696'Power module having at least two substrates'20097,176,057'Power module comprising at least two substrates and method for producing the same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2020Patents assigned to INFINEON TECHNOLOGIES AG (13)· patent assignee history
2007–2020Based in Neumarkt, DE· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 13 | 2007–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Neumarkt, DE | 14 | 2007–2020 |