LexDanaLexDanabeta
Inventor

Hiroyuki Fujiwara

Inventor
Hachioji, JP

Overview

76→
Patents
1982–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 76 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers24%
B41JTypewriters20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H05KPrinted circuits8%
Y10TTechnical subjects covered by former us classification4%
G03GElectrography3%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
B60NSeats specially adapted for vehicles2%
G02BOptical elements, systems or apparatus2%
H01LSemiconductor devices2%
PatentTitleYear
10,859,478Biaxial load test specimen, biaxial load test apparatus, and biaxial load test method202010,852,770Electronic device having a waterproof structure202010,701,849Component placement machine and component placement method202010,617,048Component supplier and component supplying method202010,473,856Optical branching/coupling device and optical transmission/reception module201910,477,748Component mounting device and component mounting method201910,356,969Component mounter201910,349,569Component mounting device and component mounting method201910,165,716Substrate conveyance mechanism and component mounting method20189,848,520Component mounting apparatus20179,841,570'Optical fiber assembly, optical coupling device, and optical fiber coupling device'20179,615,494'Substrate conveyance mechanism and component mounting device'20179,093,562'Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head'20159,032,612'Mounting head and component mounting apparatus'20159,022,074'Plug for heat-conducting tube, device for attaching plug for heat-conducting tube, and method for plugging heat conducting tube'20158,941,260'Vehicle light control device'20158,911,016'Seat structure'20148,830,127'Patch antenna and method of mounting the same'20148,816,364'Display apparatus'20148,816,384'Semiconductor apparatus with thin semiconductor film'20148,664,668'Combined semiconductor apparatus with semiconductor thin film'20148,664,672'Light emitting panel having a plurality of light emitting element arrays arranged in descending order of wavelength'20148,497,893'Semiconductor device, optical print head and image forming apparatus'20138,445,935'Semiconductor apparatus with thin semiconductor film'20138,415,680'Semiconductor composite apparatus, print head, and image forming apparatus'20138,395,159'Semiconductor apparatus with thin semiconductor film'20138,384,221'Semiconductor device, LED head and method of manufacturing the same'20138,343,848'Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device'20138,311,703'Control system'20128,304,792'Semiconductor light emitting apparatus and optical print head'20128,269,314'Display apparatus'20128,258,537'Efficient light emitting semiconductor device'20128,249,780'Seat control device'20128,163,319'Method of production of an alcohol-dipped food or drink'20128,134,164'Semiconductor device, optical print head and image forming apparatus'20128,052,214'Seat structure'20118,035,116'Semiconductor device, light emitting diode head, and image forming apparatus'20118,022,387'Composite semiconductor device having a thyristor structure'20118,022,418'Composite semiconductor device, LED print head that employs the composite semiconductor device, and image forming apparatus that employs the LED print head'20117,999,275'Composite semiconductor device, LED head that employs the composite semiconductor device, and image forming apparatus that employs the LED head'20117,947,576'Method of manufacturing by etching a semiconductor substrate horizontally without creating a vertical face'20117,928,572'Composite semiconductor device'20117,893,455'Semiconductor light emitting device with stress absorber, LED printhead, and image forming apparatus'20117,871,834'Combined semiconductor apparatus with thin semiconductor films'20117,754,512'Method of fabricating semiconductor light-emitting devices with isolation trenches'20107,625,809'Semiconductor device and method of manufacturing the same'20097,541,620'Semiconductor device, light emitting diode print head, and image forming apparatus'20097,486,307'Semiconductor apparatus having conductive layers and semiconductor thin films'20097,456,449'Semiconductor apparatus, LED print head, and printer'20087,408,566'Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device'20087,384,101'Bracket angle adjustment mechanism'20087,361,935'Semiconductor device, LED print head, that uses the semiconductor, and image forming apparatus that uses the LED print head'20087,242,026'Semiconductor light-emitting device'20077,239,337'Combined semiconductor apparatus with thin semiconductor films'20077,180,099'Semiconductor apparatus with thin semiconductor film'20077,135,708'Semiconductor apparatus having conductive layers and semiconductor thin films'20067,131,478'Component supply system'20067,122,834'Semiconductor apparatus having adhesion layer and semiconductor thin film'20067,078,729'Semiconductor device and method of manufacturing the same'20067,065,269'Optical multiplexer/demultiplexer, optical integrated circuit and light transceiver using the same'20067,061,113'Semiconductor apparatus, led head, and image forming apparatus'20066,913,985'Method of manufacturing a semiconductor device'20056,910,514'Part feeder'20056,909,122'Semiconductor light-emitting device with isolation trenches, and method of fabricating same'20056,790,695'Semiconductor device and method of manufacturing the same'20046,781,246'Semiconductor array device with single interconnection layer'20046,765,235'Array of semiconductor elements with paired driving scheme'20046,541,796'Opto-electronic device with self-aligned ohmic contact layer'20036,291,328'Opto-electronic device with self-aligned ohmic contact layer'20015,955,748'End face light emitting type light emitting diode'19995,869,848'End face light-emitting-type LED, end face light-emitting-type LED array and methods of manufacturing them'19995,866,439'Method of fabricating an end face light emitting type light-emitting diode and a light-emitting diode array device'19995,862,086'Semiconductor storage device'19995,525,023'Chip component supply apparatus'19965,299,902'Chip-type electronic element supplying apparatus'19944,362,480'Rotary roller vane pump made of specific materials'1982

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2020Based in Tokyo, JP· patent location history
2001–2015Patents assigned to OKI DATA KK (44)· patent assignee history
2001–2014Based in Hachioji, JP· patent location history
2005–2020Based in Yamanashi, JP· patent location history
2012–2015Patents assigned to FUJIWARA HIROYUKI (22)· patent assignee history
2012–2015Patents assigned to OGIHARA MITSUHIKO (12)· patent assignee history
2012–2015Patents assigned to SUZUKI TAKAHITO (7)· patent assignee history
2014–2020Based in Hanno, JP· patent location history
2015–2020Patents assigned to PANASONIC IP MAN CO LTD (9)· patent assignee history
2017–2019Based in Kawaguchi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
OKI DATA KK442001–2015
FUJIWARA HIROYUKIself222012–2015
OGIHARA MITSUHIKO122012–2015
PANASONIC IP MAN CO LTD92015–2020
SUZUKI TAKAHITO72012–2015
Locations
LocationPatentsSpan
Hachioji, JP282001–2014
Tokyo, JP201999–2020
Yamanashi, JP112005–2020
Hanno, JP22014–2020
Kawaguchi, JP22017–2019