Inventor
Douglas E. Dolan
Inventor
York, ME, US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
H10DInorganic electric semiconductor devices40%
PatentTitleYear
8,598,035'Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same'20137,960,800'Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same'20117,242,076'Packaged integrated circuit with MLP leadframe and method of making same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2013Patents assigned to FAIRCHILD SEMICONDUCTOR (3)· patent assignee history
2007Based in Hollis Center, ME, US· patent location history
2011–2013Based in York, ME, US· patent location history
2013Patents assigned to DOLAN DOUGLAS E (1)· patent assignee history
2013Patents assigned to GRUENHAGEN MICHAEL D (1)· patent assignee history
2013Patents assigned to KIM SUKU (1)· patent assignee history
2013Patents assigned to LARSEN MARK (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FAIRCHILD SEMICONDUCTOR | 3 | 2007–2013 |
| DOLAN DOUGLAS Eself | 1 | 2013 |
| GRUENHAGEN MICHAEL D | 1 | 2013 |
| KIM SUKU | 1 | 2013 |
| LARSEN MARK | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| York, ME, US | 2 | 2011–2013 |
| Hollis Center, ME, US | 1 | 2007 |