Inventor
BO-HSUN PAN
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,532,752Packages with multiple exposed pads202611,942,448Integrated circuit die pad cavity202411,862,538Semiconductor die mounted in a recess of die pad202411,848,297Semiconductor device packages with high angle wire bonding and non-gold bond wires202311,817,374Electronic device with exposed tie bar202311,742,265Exposed heat-generating devices202311,735,506Packages with multiple exposed pads2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to TEXAS INSTRUMENTS INC (7)· patent assignee history
2023–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 7 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 7 | 2023–2026 |