Inventor
Shintaro Isono
Inventor
Tokyo, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing56%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
G05BControl or regulating systems in general11%
PatentTitleYear
10,464,185Substrate polishing method, top ring, and substrate polishing apparatus201910,391,603Polishing apparatus, control method and recording medium201910,213,896Elastic membrane, substrate holding apparatus, and polishing apparatus20199,999,956Polishing device and polishing method20189,573,244'Elastic membrane, substrate holding apparatus, and polishing apparatus'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2019Based in Tokyo, JP· patent location history
2018–2019Patents assigned to EBARA CORP (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 4 | 2018–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 5 | 2017–2019 |