Inventor
Hsien-Shih Chu
Inventor
Kaohsiung, TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1023%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H10BElectronic memory devices13%
H10DInorganic electric semiconductor devices10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
PatentTitleYear
11,133,320Method for fabricating semiconductor device202111,069,690DRAM and flash structure and method of fabricating the same202110,475,649Patterning method201910,304,679Method of fabricating a mask201910,249,629Method for forming buried word lines201910,199,258Method of fabricating isolation structure201910,192,777Method of fabricating STI trench201910,062,700Semiconductor storage device and manufacturing method thereof201810,032,631Method of fabricating mask pattern2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2021Patents assigned to FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD (9)· patent assignee history
2018–2021Patents assigned to UNITED MICROELECTRONICS CORP (9)· patent assignee history
2018–2019Based in Kaohsiung, TW· patent location history
2019Patents assigned to FUJIAN JIANHUA INTEGRATED CIRCUIT CO LTD (1)· patent assignee history
2021Based in Tainan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD | 9 | 2018–2021 |
| UNITED MICROELECTRONICS CORP | 9 | 2018–2021 |
| FUJIAN JIANHUA INTEGRATED CIRCUIT CO LTD | 1 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 7 | 2018–2019 |
| Tainan, TW | 2 | 2021 |