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Inventor

Farrah J. Johnson

Inventor
Boise, ID, US

Overview

4→
Patents
2001–2009
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
Y10TTechnical subjects covered by former us classification30%
G01NInvestigating or analysing materials by determining their chemical or physical properties10%
PatentTitleYear
7,578,056'Method of coating contacts on a surface of a flip chip'20097,150,390'Flip chip dip coating encapsulant'20066,551,863'Flip chip dip coating encapsulant'20036,198,861'Method of using thin-clad near infrared transparent optical glass fibers as evanescent wave sensors'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001Patents assigned to SOUTH DAKOTA SCHOOL OF MINES A (1)· patent assignee history
2001Based in Rapid City, SD, US· patent location history
2003–2009Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
2003–2009Based in Boise, ID, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC32003–2009
SOUTH DAKOTA SCHOOL OF MINES A12001
Locations
LocationPatentsSpan
Boise, ID, US32003–2009
Rapid City, SD, US12001