LexDanaLexDanabeta
Inventor

HONGFENG DONG

Inventor
US

Overview

3→
Patents
2022–2025
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G06Fprimary
G06FElectric digital data processing40%
B22FWorking metallic powder20%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form20%
C22CAlloys20%
PatentTitleYear
12,436,761Instruction applicable to radix-3 butterfly computation202511,900,111Permutation instruction202411,253,919Toughened TiAl-based alloy sheet with periodically misaligned through-hole titanium alloy layers and preparation method thereof2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to UNIV SHAANXI TECHNOLOGY (1)· patent assignee history
2022Based in CN· patent location history
2024–2025Patents assigned to QUALCOMM INC (2)· patent assignee history
2024–2025Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
QUALCOMM INC22024–2025
UNIV SHAANXI TECHNOLOGY12022
Locations
LocationPatentsSpan
US22024–2025
CN12022