Inventor

Tsutomu Mitani

Inventor

Hyogo, JP

Overview

30→

Patents

1987–2010

Patent span

Electricity

Primary field (CPC H)

Patents· 30 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits17%

Y10TTechnical subjects covered by former us classification17%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%

Y02PClimate change mitigation technologies in the production or processing of goods8%

C09JAdhesives7%

H01BCables6%

C23CCoating metallic material5%

G11BInformation storage based on relative movement between record carrier and transducer4%

H01RElectrically-conductive connections4%

PatentTitleYear

7,859,855'Module and mounted structure using the same'2010 7,667,974'Module and mounted structure using the same'2010 7,151,306'Electronic part, and electronic part mounting element and an process for manufacturing such the articles'2006 6,853,074'Electronic part, an electronic part mounting element and a process for manufacturing such the articles'2005 6,814,893'Conductive adhesive agent, packaging structure, and method for manufacturing the same structure'2004 6,756,663'Semiconductor device including wiring board with three dimensional wiring pattern'2004 6,749,774'Conductive adhesive and connection structure using the same'2004 6,749,889'Method for producing mounting structure for an electronic component'2004 6,675,474'Electronic component mounted member and repair method thereof'2004 6,666,994'Conductive adhesive and packaging structure using the same'2003 6,620,345'Conductive adhesive agent, packaging structure, and method for manufacturing the same structure'2003 6,569,512'Mounting structure for an electronic component and method for producing the same'2003 6,525,414'Semiconductor device including a wiring board and semiconductor elements mounted thereon'2003 6,524,721'Conductive adhesive and packaging structure using the same'2003 6,521,144'Conductive adhesive and connection structure using the same'2003 6,512,183'Electronic component mounted member and repair method thereof'2003 6,510,059'Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module'2003 6,376,051'Mounting structure for an electronic component and method for producing the same'2002 6,042,953'Substrate on which bumps are formed and method of forming the same'2000 5,914,274'Substrate on which bumps are formed and method of forming the same'1999 5,674,573'Method of synthesizing diamond-like carbon thin films'1997 5,378,285'Apparatus for forming a diamond-like thin film'1995 5,370,292'Magnetic tape driving mechanism having a capstan with a surface made of carbon film including diamond-bonded carbons'1994 5,360,483'Plasma CVD apparatus and method therefor'1994 5,203,924'Method of and apparatus for synthesizing diamondlike thin film'1993 5,168,023'Photosensitive element used in electrophotography'1992 4,835,070'Magnetic recording medium and method of producing the same'1989 4,833,031'Magnetic recording medium'1989 4,717,622'Magnetic recording media'1988 4,645,977'Plasma CVD apparatus and method for forming a diamond like carbon film'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–2006Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (27)· patent assignee history

1987–1989Based in Neyagawa, JP· patent location history

1992–2010Based in Akashi, JP· patent location history

1999–2010Based in Hyogo, JP· patent location history

2003Based in Osaka, JP· patent location history

2004Patents assigned to MATSUSHITA ELECTRIC INDUSTIRAL (1)· patent assignee history

2010Patents assigned to PANASONIC CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD	27	1987–2006
PANASONIC CORP	2	2010
MATSUSHITA ELECTRIC INDUSTIRAL	1	2004

Locations

Location	Patents	Span
Hyogo, JP	15	1999–2010
Akashi, JP	10	1992–2010
Neyagawa, JP	4	1987–1989
Osaka, JP	1	2003