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Inventor

Yoshikuni Nakadaira

Inventor
Hodogaya-ku, JP

Overview

7→
Patents
1998–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 7 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H01LSemiconductor devices28%
B23KSoldering or unsoldering11%
H05KPrinted circuits11%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
9,716,075'Semiconductor chip assembly and method for making same'20179,337,165'Method for manufacturing a fan-out WLP with package'20169,137,903'Semiconductor chip assembly and method for making same'20158,957,520'Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts'20158,890,304'Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material'20148,525,338'Chip with sintered connections to package'20135,763,946'Semiconductor device with bent electrode terminal'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2017Based in Yokohama, JP· patent location history
2013–2017Patents assigned to TESSERA INC (6)· patent assignee history
2013–2015Patents assigned to DAMBERG PHILIP (4)· patent assignee history
2013–2015Patents assigned to HABA BELGACEM (4)· patent assignee history
2013–2015Patents assigned to MASUDA NORIHITO (4)· patent assignee history
2013–2015Patents assigned to MOHAMMED ILYAS (4)· patent assignee history
2013–2015Based in Hodogaya-ku, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TESSERA INC62013–2017
DAMBERG PHILIP42013–2015
HABA BELGACEM42013–2015
MASUDA NORIHITO42013–2015
MOHAMMED ILYAS42013–2015
Locations
LocationPatentsSpan
Hodogaya-ku, JP42013–2015
Yokohama, JP31998–2017