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Inventor

ChanHoon Ko

Inventor
Incheon, KR

Overview

5→
Patents
2012–2015
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1083%
H01LSemiconductor devices17%
PatentTitleYear
9,054,098'Integrated circuit packaging system with redistribution layer and method of manufacture thereof'20158,530,277'Integrated circuit packaging system with package on package support and method of manufacture thereof'20138,455,300'Integrated circuit package system with embedded die superstructure and method of manufacture thereof'20138,304,296'Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof'20128,217,502'Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2015Patents assigned to KO CHANHOON (5)· patent assignee history
2012–2015Patents assigned to STATS CHIPPAC LTD (5)· patent assignee history
2012Patents assigned to KWON WONIL (1)· patent assignee history
2012–2015Based in Incheon, KR· patent location history
2013–2015Patents assigned to CHI HEEJO (2)· patent assignee history
2013–2015Patents assigned to CHO NAMJU (2)· patent assignee history
2013Based in Ichon-si, KR· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KO CHANHOONself52012–2015
STATS CHIPPAC LTD52012–2015
CHI HEEJO22013–2015
CHO NAMJU22013–2015
KWON WONIL12012
Locations
LocationPatentsSpan
Incheon, KR42012–2015
Ichon-si, KR12013