Inventor
Yuusaku Ooki
Inventor
Shizuoka, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Rprimary
H01RElectrically-conductive connections38%
C08LCompositions of macromolecular compounds25%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients19%
C09KMaterials for miscellaneous applications, not provided for elsewhere13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
PatentTitleYear
9,994,747Seal member20188,501,847'Thermoplastic elastomer resin composition and connector'20138,466,217'Flexible resin composition and sealing part for waterproof connector'20138,449,328'Thermoplastic elastomer resin composition and connector'20138,215,988'Waterproof electrical connector'20128,011,976'Waterproof connector and method for producing the same'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2018Patents assigned to YAZAKI CORP (6)· patent assignee history
2011–2018Based in Shizuoka, JP· patent location history
2012–2013Patents assigned to OOKI YUUSAKU (4)· patent assignee history
2012Patents assigned to SAKAMOTO NOBUYUKI (1)· patent assignee history
2012Based in Makinohara-shi, JP· patent location history
2013Patents assigned to HASHIMOTO HIROSHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| YAZAKI CORP | 6 | 2011–2018 |
| OOKI YUUSAKUself | 4 | 2012–2013 |
| HASHIMOTO HIROSHI | 1 | 2013 |
| SAKAMOTO NOBUYUKI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shizuoka, JP | 5 | 2011–2018 |
| Makinohara-shi, JP | 1 | 2012 |