Inventor
Robert D. Topa
Inventor
Binghamton, NY, US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H05KPrinted circuits16%
Y10TTechnical subjects covered by former us classification8%
B01DSeparation4%
B08BCleaning in general4%
C23CCoating metallic material4%
C23FNon-mechanical removal of metallic material from surface4%
C23GCleaning or de-greasing of metallic material by chemical methods other than electrolysis4%
C25DProcesses for the electrolytic or electrophoretic production of coatings4%
PatentTitleYear
6,626,196'Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing'20036,228,246'Removal of metal skin from a copper-Invar-copper laminate'20016,179,990'Biased acid cleaning of a copper-invar-copper laminate'20015,242,569'Thermocompression bonding in integrated circuit packaging'19935,237,743'Method of forming a conductive end portion on a flexible circuit member'19935,148,261'Thermocompression bonding in integrated circuit packaging'19925,135,155'Thermocompression bonding in integrated circuit packaging'19925,120,418'Lead frame plating apparatus for thermocompression bonding'19925,006,917'Thermocompression bonding in integrated circuit packaging'19914,564,426'Process for the deposition of palladium-nickel alloy'1986Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1986–2003Patents assigned to IBM (10)· patent assignee history
1986–2003Based in Binghamton, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 10 | 1986–2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Binghamton, New York, US | 10 | 1986–2003 |