Inventor
Lannie R. Bolde
Inventor
New Paltz, NY, US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering25%
H05KPrinted circuits20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
Y10TTechnical subjects covered by former us classification6%
B66FHoisting, lifting, hauling or pushing, not otherwise provided for, e.g. devices which apply a lifting or pushing force directly to the surface of a load2%
F26BDrying solid materials or objects by removing liquid therefrom2%
G01RMeasuring electric variables2%
G03DApparatus for processing exposed photographic materials2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
PatentTitleYear
10,973,157Printed circuit card assembly connectable to a server chassis202110,930,411Hybrid cable assembly having shielded and unshielded portions20219,108,828'Lift mechanism'20157,806,312'Method and apparatus for removing known good die'20107,296,725'Feed devices and methods for injection molded solder systems'20077,168,609'Method and apparatus for removing known good die'20077,131,565'Feed devices and methods for injection molded solder systems'20066,942,137'Die removal method and apparatus'20056,915,563'Apparatus for removing attached die'20056,888,363'Method and device for cooling/heating die during burn in'20056,811,072'Known good die removal method and apparatus'20046,745,450'Method for loading solder balls into a mold'20046,360,940'Method and apparatus for removing known good die'20026,276,596'Low temperature solder column attach by injection molded solder and structure formed'20016,186,216'Cast column grid array extraction apparatus and method'20016,182,356'Apparatus for solder ball mold loading'20016,153,505'Plastic solder array using injection molded solder'20006,029,882'Plastic solder array using injection molded solder'20005,982,038'Cast metal seal for semiconductor substrates'19995,971,058'Apparatus and method for continuous casting solder onto discrete parts'19995,913,985'Fixture and method for securing electronic modules during wet processing'19995,821,161'Cast metal seal for semiconductor substrates and process thereof'19985,170,058'Apparatus and a method for alignment verification having an opaque work piece between two artwork masters'19925,167,078'Compact photo resist dryer'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2021Patents assigned to IBM (24)· patent assignee history
1992–2010Based in New Paltz, NY, US· patent location history
2001Based in New York, NY, US· patent location history
2015–2021Based in Ulster Park, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 24 | 1992–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Paltz, New York, US | 20 | 1992–2010 |
| Ulster Park, New York, US | 3 | 2015–2021 |
| New York, New York, US | 1 | 2001 |