Inventor
WILLIAM T. WEAVER
Inventor
US
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1043%
C23CCoating metallic material7%
H01JElectric discharge tubes or discharge lamps7%
PatentTitleYear
12,315,747Workpiece handling architecture for high workpiece throughput202512,315,748Workpiece handling architecture for high workpiece throughput202512,002,649Spinning disk with electrostatic clamped platens for ion implantation202411,817,332Multi-wafer volume single transfer chamber facet202311,315,806Batch heating and cooling chamber or loadlock202211,264,258Buffer chamber wafer heating mechanism and supporting robots2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to APPLIED MATERIALS INC (6)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 6 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 6 | 2022–2025 |