Inventor
Chia-Fu Lin
Inventor
Hsinchu, TW
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
Y10TTechnical subjects covered by former us classification12%
H05KPrinted circuits9%
B23KSoldering or unsoldering6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
B01DSeparation3%
B08BCleaning in general3%
B29CShaping or joining of plastics3%
B41NPrinting plates or foils3%
PatentTitleYear
8,497,584'Method to improve bump reliability for flip chip device'20137,906,425'Fluxless bumping process'20117,468,321'Application of impressed-current cathodic protection to prevent metal corrosion and oxidation'20087,276,454'Application of impressed-current cathodic protection to prevent metal corrosion and oxidation'20077,134,199'Fluxless bumping process'20066,974,659'Method of forming a solder ball using a thermally stable resinous protective layer'20056,918,397'Flush system for dry film photoresist remover'20056,805,279'Fluxless bumping process using ions'20046,802,250'Stencil design for solder paste printing'20046,797,075'Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication'20046,765,277'Microelectronic fabrication with corrosion inhibited bond pad'20046,756,294'Method for improving bump reliability for flip chip devices'20046,743,660'Method of making a wafer level chip scale package'20046,715,524'DFR laminating and film removing system'20046,712,260'Bump reflow method by inert gas plasma'20046,636,313'Method of measuring photoresist and bump misalignment'20036,602,775'Method to improve reliability for flip-chip device for limiting pad design'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2013Patents assigned to TAIWAN SEMICONDUCTOR MFG (16)· patent assignee history
2003–2013Based in Hsinchu, TW· patent location history
2013Patents assigned to CHEN LI-CHIH (1)· patent assignee history
2013Patents assigned to CHEN YEN-MING (1)· patent assignee history
2013Patents assigned to CHING KAI-MING (1)· patent assignee history
2013Patents assigned to HSU SHUN-LIANG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 16 | 2003–2013 |
| CHEN LI-CHIH | 1 | 2013 |
| CHEN YEN-MING | 1 | 2013 |
| CHING KAI-MING | 1 | 2013 |
| HSU SHUN-LIANG | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 17 | 2003–2013 |