Inventor

Mitsuhito Suwa

Inventor

Otsu, JP

Overview

1998–2020

Patent span

Chemistry

Primary field (CPC C)

Patents· 35 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices18%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds10%

C09DCoating compositions, e.g. paints, varnishes or lacquers9%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients6%

C08LCompositions of macromolecular compounds6%

G06FElectric digital data processing5%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds5%

H01LSemiconductor devices5%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%

PatentTitleYear

10,877,607Laminated base material, cover glass, touch panel, and method for manufacturing laminated base material2020 10,858,509Resin composition, cured film, method for producing cured film, and display device2020 10,788,750Photosensitive resin composition, cured film, laminate, touch panel member, and method for manufacturing cured film2020 10,316,146Resin composition, solid imaging element obtained using same, and process for producing same2019 10,001,704Photosensitive resin composition, method of manufacturing conductive pattern, substrate, element, and touch panel2018 9,989,852Positive photosensitive resin composition, cured film formed by curing same, and optical device equipped with same2018 9,977,329Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated CMOS image sensor2018 9,788,420'Substrate and touch panel member using same'2017 9,704,724'Photosensitive resin composition and method for producing semiconductor device'2017 9,690,197'Negative-type photosensitive white composition for touch panel, touch panel and touch panel production method'2017 9,691,935'Impurity-diffusing composition and method for producing semiconductor element'2017 9,651,865'Negative-type photosensitive coloring composition, cured film, light-shielding pattern for touch panel, and touch panel manufacturing method'2017 9,510,444'Substrate and touch panel member using same'2016 8,901,225'Photosensitive resin composition, laminate utilizing same and solid-state imaging device'2014 8,828,642'Positive photosensitive resin composition, cured film obtained using same, and optical device'2014 8,492,450'Siloxane resin composition and protective film for touch panel using the same'2013 8,389,649'Siloxane-based resin composition'2013 8,338,510'Photosensitive siloxane composition, cured film formed therefrom and device having the cured film'2012 7,977,400'Photosensitive resin composition'2011 7,507,518'Photosensitive resin precursor composition'2009 7,476,476'Photosensitive resin composition, electronic component using the same, and display unit using the same'2009 7,374,856'Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film'2008 6,933,087'Precursor composition for positive photosensitive resin and display made with the same'2005 6,887,643'Photosensitive resin precursor composition'2005 6,727,032'Radiation-sensitive resin composition'2004 6,692,887'Radiation-sensitive resin composition'2004 6,593,043'Composition of positive photosensitive resin precursor, and display device thereof'2003 6,524,764'Positive-type photosensitive polyimide precursor composition'2003 6,322,949'Radiation sensitive resin composition'2001 6,309,747'Liquid curable resin composition for optical fibers'2001 6,187,504'Radiation sensitive resin composition'2001 6,180,316'Radiation sensitive resin composition'2001 5,913,004'Optical glass fiber coating composition'1999 5,804,311'Liquid curable resin composition for optical fibers'1998 5,787,218'Liquid curable urethane (meth)acrylate containing resin composition'1998

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1998–2001Patents assigned to DSM NV (4)· patent assignee history

1998–2001Patents assigned to JAPAN SYNTHETIC RUBBER CO LTD (2)· patent assignee history

1998–2004Based in Yokkaichi, JP· patent location history

1999–2004Patents assigned to JSR CORP (6)· patent assignee history

2001Based in Mie, JP· patent location history

2003–2020Patents assigned to TORAY INDUSTRIES (25)· patent assignee history

2003–2020Based in Otsu, JP· patent location history

2003–2012Based in Shiga, JP· patent location history

2012–2014Patents assigned to SUWA MITSUHITO (5)· patent assignee history

2014Based in Otu, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TORAY INDUSTRIES	25	2003–2020
JSR CORP	6	1999–2004
SUWA MITSUHITOself	5	2012–2014
DSM NV	4	1998–2001
JAPAN SYNTHETIC RUBBER CO LTD	2	1998–2001

Locations

Location	Patents	Span
Otsu, JP	20	2003–2020
Yokkaichi, JP	6	1998–2004
Shiga, JP	5	2003–2012
Mie, JP	3	2001
Otu, JP	1	2014