LexDanaLexDanabeta
Inventor

Hidekazu Masuo

Inventor
Kanagawa, JP

Overview

1→
Patents
2018
Patent span
Performing operations
Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing50%
B24DTools for grinding, buffing or sharpening50%
PatentTitleYear
10,105,814Polishing sheet, polishing tool and polishing method2018

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2018Patents assigned to HASHIYADA TSUYOSHI (1)· patent assignee history
2018Patents assigned to HOSHINO YUTARO (1)· patent assignee history
2018Patents assigned to KIKUTA WATARU (1)· patent assignee history
2018Patents assigned to KOETSUKA KYOHTA (1)· patent assignee history
2018Patents assigned to MASUO HIDEKAZU (1)· patent assignee history
2018Based in Kanagawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HASHIYADA TSUYOSHI12018
HOSHINO YUTARO12018
KIKUTA WATARU12018
KOETSUKA KYOHTA12018
MASUO HIDEKAZUself12018
Locations
LocationPatentsSpan
Kanagawa, JP12018