Inventor
Ali Mira
Inventor
Morgan Hill, CA, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
LOC13primary
LOC1334%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact9%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application9%
H05KPrinted circuits9%
G06FElectric digital data processing6%
H01LSemiconductor devices6%
PatentTitleYear
D0905647Combination heat pipe and heat sink202010,612,862Method of forming a combined vapor chamber and heat pipe assembly2020D0842822Flexible folded fin heatsink with straight and radial fin patterns201910,211,125Configurable mounting hole structure for flush mount integration with vapor chamber forming plates2019D0829673Combined liquid cooling cold plate and vapor chamber2018D0810034'Flexible folded fin heatsink with straight and radial fin patterns'2018D0805043'Heatsink for optical modules'2017D0803169'Combined liquid cooling cold plate and vapor chamber'2017D0795821'Liquid cooling cold plate with diamond cut pin fins'2017D0722573'U-shaped condenser heat sink for low profile modules'2015D0722574'Power heat sink with hybrid vapor chamber—heat pipe module'2015D0715750'Power heat sink with imbedded fly cut heat pipes'2014D0715749'High performance high power tower heat sink'2014D0715748'Inverted floating core heat sink'20148,109,321'Modular heat sink assembly comprising a larger main heat sink member thermally connected to smaller additional floating heat sink members'20126,459,579'Apparatus and method for directing airflow in three dimensions to cool system components'20025,999,437'Processor-inclusive memory module'19995,867,419'Processor-inclusive memory module'19995,735,340'Heat sink with integral attachment mechanism'19985,709,263'High performance sinusoidal heat sink for heat removal from electronic equipment'19985,710,733'Processor-inclusive memory module'19985,662,163'Readily removable heat sink assembly'19975,661,638'High performance spiral heat sink'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–1999Patents assigned to SILICON GRAPHICS INC (7)· patent assignee history
1997–2002Based in San Jose, CA, US· patent location history
2012Patents assigned to ALCATEL LUCENT (1)· patent assignee history
2012Patents assigned to ALOUSI SINAN (1)· patent assignee history
2012–2020Based in Morgan Hill, CA, US· patent location history
2014–2015Patents assigned to HEATSCAPE INC (5)· patent assignee history
2017–2020Patents assigned to HEATSCAPE COM INC (9)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEATSCAPE COM INC | 9 | 2017–2020 |
| SILICON GRAPHICS INC | 7 | 1997–1999 |
| HEATSCAPE INC | 5 | 2014–2015 |
| ALCATEL LUCENT | 1 | 2012 |
| ALOUSI SINAN | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Morgan Hill, California, US | 15 | 2012–2020 |
| San Jose, California, US | 8 | 1997–2002 |