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Inventor

Takuo Ozawa

Inventor
Tokyo, JP

Overview

3→
Patents
2001–2006
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
B23KSoldering or unsoldering13%
B64GCosmonautics13%
Y02PClimate change mitigation technologies in the production or processing of goods13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests13%
PatentTitleYear
7,078,330'Metal electrode and bonding method using the metal electrode'20066,722,614'Satellite deployment structure'20046,241,145'Lead-free solder joining method and electronic module manufactured by using the method'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2006Patents assigned to MITSUBISHI ELECTRIC CORP (3)· patent assignee history
2001–2006Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI ELECTRIC CORP32001–2006
Locations
LocationPatentsSpan
Tokyo, JP32001–2006