Inventor
Hideshi Abe
Inventor
Kanagawa, JP
Overview
Patents· 71 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Fprimary
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation44%
H04NPictorial communication, e.g. television13%
H01LSemiconductor devices10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
G02BOptical elements, systems or apparatus5%
H10DInorganic electric semiconductor devices5%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%
H10KOrganic electric solid-state devices2%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution2%
PatentTitleYear
11,076,078Solid-state imaging device with uneven structures and method for manufacturing the same, and electronic apparatus202110,855,893Solid-state imaging device with uneven structures and method for manufacturing the same, and electronic apparatus202010,771,664Solid-state imaging device with uneven structures and the method for manufacturing the same, and electronic apparatus202010,741,595Imaging device and method for manufacturing the same202010,412,287Solid-state imaging device and method for manufacturing electronic apparatus201910,326,920Solid-state imaging device and method for manufacturing the same, and electronic apparatus201910,304,884Imaging device and method for manufacturing the same201910,147,755Solid-state imaging device, method of manufacturing the same, and electronic apparatus201810,044,918Solid-state imaging device having an anti-reflection feature and method for manufacturing the same20189,831,284Method of manufacturing an imaging device20179,819,846'Solid-state imaging device having a moth-eye structure and light blocking portions, method for manufacturing the same, and electronic apparatus'20179,794,457'Solid-state imaging device having a moth-eye structure and light blocking portions, method for manufacturing the same, and electronic apparatus'20179,620,545'Solid-state image pickup device and method for producing the same'20179,312,300'Solid-state imaging device, method of manufacturing the same, and electronic apparatus'20169,264,631'Infrared conversion device, imaging apparatus, and imaging method'20168,993,369'Solid-state imaging device and method for manufacturing the same'20158,741,681'Solid-state image pickup device and method for producing the same'20148,728,847'Solid-state imaging device and method for manufacturing the same'20148,652,864'Solid-state image pickup device and method for producing the same'20148,598,640'Solid-state imaging device'20138,384,817'Solid-state imager, method of manufacturing the same, and camera'20138,253,830'Solid state image device having multiple PN junctions in a depth direction, each of which provides an output signal'20128,138,065'Solid-state imaging device and method for manufacturing the same'20128,110,856'Solid-state imaging device and method for manufacturing the same'20128,017,984'Solid-state imaging device'20118,004,056'Solid-state imaging device and method for manufacturing the same'20117,985,614'Solid-state imaging device and method for manufacturing the same'20117,981,769'Solid-state imaging device and method for manufacturing the same'20117,943,962'Solid-state image pickup device and method for producing the same'20117,935,563'Solid-state imaging device and method for manufacturing thereof as well as driving method of solid-state imaging device'20117,928,487'Solid-state imaging device and driving method of solid-state imaging device'20117,898,000'Solid-state image pickup device and method for producing the same'20117,879,637'CMOS solid-state imaging device and method of manufacturing the same as well as drive method of CMOS solid-state imaging device'20117,821,093'Solid-state imaging device with biased light shielding film'20107,791,118'Solid-state imaging device'20107,714,915'Solid-state image device having multiple PN junctions in a depth direction, each of which provides and output signal'20107,659,183'Solid-state imaging device and method for manufacturing the same'20107,646,047'Solid-state imaging device and method for manufacturing the same'20107,595,214'Solid-state image pickup device and manufacturing method for the same'20097,560,754'CMOS solid-state imaging device and method of manufacturing the same as well as drive method of CMOS solid-state imaging device'20097,473,977'Method of driving solid state image sensing device'20097,468,289'Solid-state imaging device and method for manufacturing the same'20087,465,598'Solid-state imaging device and method for fabricating same'20087,420,234'Solid-state imaging device and method for fabricating same'20087,382,007'Solid-state image pickup device and manufacturing method for the same'20087,351,598'Solid-stage image pickup device and method for producing the same'20087,352,013'Solid-state imaging device and manufacturing method thereof'20087,217,961'Solid-state image pickup device and method for producing the same'20077,105,867'Solid-state imaging device and manufacturing method thereof'20067,087,939'Solid-state imaging device and manufacturing method thereof'20067,084,443'Solid-state image pickup device and manufacturing method for the same'20067,041,956'Solid-state image pickup device with non-hydrogen-absorbing waveguide'20066,867,438'Solid-state imaging device and manufacturing method thereof'20056,774,444'Semiconductor, solid-state imaging device, and method for making the same'20046,750,159'Semiconductor apparatus, manufacturing method therefor, solid state image device and manufacturing method therefor'20046,599,772'Solid-state pickup element and method for producing the same'20036,521,920'Solid state image sensor'20036,436,729'Process for producing solid image pickup device and solid image pickup device'20026,312,969'Solid-state imaging sensor, manufacturing method thereof and imaging device'20016,278,154'Semiconductor apparatus and solid state imaging device'20016,252,219'Solid-state imaging element'20016,246,081'Solid-state imaging sensor, manufacturing method thereof and imaging device'20015,869,352'Method of manufacturing an amplifying solid-state imaging device'19995,808,333'Amplifying type solid-state imaging device and method of manufacturing the same'19985,581,099'CCD solid state image device which has a semiconductor substrate with a P-type region with an N-type region formed therein by injection of arsenic'19965,576,570'Semiconductor device having CMOS circuit'19965,476,808'Method of making CCD solid state image sensing device'19955,343,060'Apparatus for reducing mirror in a solid state imaging device wherein a light intercepting layer shields a transfer means from instant light and has an edge which slopes toward the light sensing region'19945,334,829'Package for solid state imager with heating means to repair imager lattice defect'19945,288,656'Method of manufacturing a CCD solid state image sensing device'19944,345,975'Process for preventing blockage in distillation column of treatment apparatus for ammoniacal waste liquid'1982Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1982Based in Kurashiki, JP· patent location history
1994–2021Patents assigned to SONY CORP (66)· patent assignee history
1994–2021Based in Kanagawa, JP· patent location history
2001Based in Kanawaga, JP· patent location history
2012–2015Patents assigned to ABE HIDESHI (9)· patent assignee history
2012–2015Patents assigned to MARUYAMA YASUSHI (4)· patent assignee history
2012–2015Patents assigned to MORI HIROYUKI (4)· patent assignee history
2017–2020Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SONY CORP | 66 | 1994–2021 |
| ABE HIDESHIself | 9 | 2012–2015 |
| MARUYAMA YASUSHI | 4 | 2012–2015 |
| MORI HIROYUKI | 4 | 2012–2015 |
| SONY SEMICONDUCTOR SOLUTIONS CORP | 3 | 2017–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 69 | 1994–2021 |
| Kanawaga, JP | 1 | 2001 |
| Kurashiki, JP | 1 | 1982 |