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Inventor

Masaki Kawata

Inventor
Nagaokakyo, JP

Overview

8→
Patents
2009–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 8 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H01LSemiconductor devices15%
Y02PClimate change mitigation technologies in the production or processing of goods15%
H03HImpedance networks, e.g. resonant circuits5%
PatentTitleYear
10,278,289Resin circuit board and resin circuit board having component mounted thereon201910,154,597Component mount board201810,098,238Method of manufacturing resin multilayer substrate20189,974,185Component-embedded substrate20189,961,780Method for manufacturing resin multilayer board20189,854,677Module component20179,730,322'Production method of component-embedded substrate, and component-embedded substrate'20177,615,874'Electronic component module'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2019Patents assigned to MURATA MANUFACTURING CO (8)· patent assignee history
2009Based in Yasu, JP· patent location history
2017–2019Based in Nagaokakyo, JP· patent location history
2018Based in Kyoto, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MURATA MANUFACTURING CO82009–2019
Locations
LocationPatentsSpan
Nagaokakyo, JP42017–2019
Kyoto, JP32018
Yasu, JP12009