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Inventor

YI-CHIH CHANG

Inventor
TW

Overview

2→
Patents
2023–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Cprimary
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems33%
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
PatentTitleYear
12,234,145Methods for wafer bonding202511,851,325Methods for wafer bonding2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2023–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD22023–2025
Locations
LocationPatentsSpan
TW22023–2025