Inventor
Katsuhiko Murayama
Inventor
Tokyo, JP
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
B25CHand-held nailing or stapling tools25%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers8%
F17CVessels for containing or storing compressed, liquefied or solidified gases8%
B24BMachines, devices, or processes for grinding or polishing6%
B27FDovetailed work6%
C30BSingle-crystal growth6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding3%
F15BSystems acting by means of fluids in general3%
PatentTitleYear
8,759,229'Method for manufacturing epitaxial wafer'20148,602,283'Gas combustion type driving tool'20138,466,071'Method for etching single wafer'20138,157,130'Gas cartridge'20128,066,896'Apparatus for etching wafer by single-wafer process and single wafer type method for etching wafer'20118,025,182'Gas cartridge'20118,006,880'Gas combustion type driving tool'20117,955,982'Method for smoothing wafer surface and apparatus used therefor'20117,938,303'Gas combustion-type driving tool'20117,906,438'Single wafer etching method'20117,762,443'Gas combustion type driving tool'20107,717,768'Wafer polishing apparatus and method for polishing wafers'20107,703,648'Gas combustion type driving tool'20107,686,197'Gas combustion type striking tool'20107,681,758'Gas cartridge'20107,648,890'Process for producing silicon wafer'20107,601,644'Method for manufacturing silicon wafers'20097,556,182'Gas combustion type driving tool'20097,488,400'Apparatus for etching wafer by single-wafer process'20097,288,207'Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the same'20077,175,063'Powered nailing machine'20076,834,666'Apparatus for outputting compressed air in compressor'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004–2013Patents assigned to MAX CO LTD (12)· patent assignee history
2004–2014Based in Tokyo, JP· patent location history
2007–2014Patents assigned to SUMCO CORP (10)· patent assignee history
2011–2014Patents assigned to MURAYAMA KATSUHIKO (5)· patent assignee history
2011–2014Patents assigned to HASHII TOMOHIRO (3)· patent assignee history
2011–2014Patents assigned to KATOH TAKEO (3)· patent assignee history
2013Based in Chuo-ku, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MAX CO LTD | 12 | 2004–2013 |
| SUMCO CORP | 10 | 2007–2014 |
| MURAYAMA KATSUHIKOself | 5 | 2011–2014 |
| HASHII TOMOHIRO | 3 | 2011–2014 |
| KATOH TAKEO | 3 | 2011–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 21 | 2004–2014 |
| Chuo-ku, JP | 1 | 2013 |