Inventor
Yongjun J. Hu
Inventor
Boise, ID, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10BElectronic memory devices19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
G06FElectric digital data processing6%
H04LTransmission of digital information, e.g. telegraphic communication6%
H04WWireless communication networks6%
H10DInorganic electric semiconductor devices6%
H10NElectric solid-state devices not otherwise provided for6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
11,133,461Laminate diffusion barriers and related devices and methods202111,127,745Devices, methods of forming a device, and memory devices202111,107,823Integrated structures and methods of forming integrated structures202111,101,171Apparatus comprising structures including contact vias and conductive lines, related methods, and memory devices202110,606,672Micro-service framework derived from third-party apps2020Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2020Patents assigned to MICROSOFT TECHNOLOGY LICENSING LLC (1)· patent assignee history
2020Based in Riverside, CA, US· patent location history
2021Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
2021Patents assigned to INTEL CORP (1)· patent assignee history
2021Based in Boise, ID, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 3 | 2021 |
| INTEL CORP | 1 | 2021 |
| MICROSOFT TECHNOLOGY LICENSING LLC | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 4 | 2021 |
| Riverside, California, US | 1 | 2020 |