Inventor
Mariano Layson Ching, Jr.
Inventor
Tianjin, CN
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure7%
H04LTransmission of digital information, e.g. telegraphic communication7%
PatentTitleYear
10,847,449Lead frame with selective patterned plating202010,734,327Lead reduction for improved creepage distance202010,734,311Hybrid lead frame for semiconductor die package with improved creepage distance202010,446,476Packaged integrated circuit having stacked die and method for therefor201910,151,658Pressure-sensing integrated circuit device with diaphragm20189,190,353'Lead frame and substrate semiconductor package'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015Patents assigned to CHING JR MARIANO LAYSON (1)· patent assignee history
2015Patents assigned to DESCARTIN ALLEN M (1)· patent assignee history
2015Patents assigned to FREESCALE SEMICONDUCTOR INC (1)· patent assignee history
2015Patents assigned to LI BO (1)· patent assignee history
2015–2020Based in Tianjin, CN· patent location history
2018–2020Patents assigned to NXP USA INC (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NXP USA INC | 5 | 2018–2020 |
| CHING JR MARIANO LAYSONself | 1 | 2015 |
| DESCARTIN ALLEN M | 1 | 2015 |
| FREESCALE SEMICONDUCTOR INC | 1 | 2015 |
| LI BO | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tianjin, CN | 6 | 2015–2020 |