Inventor
Chuen-Jye Lin
Inventor
Taichung, TW
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1048%
H04BTransmission21%
H05KPrinted circuits18%
H01LSemiconductor devices6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
PatentTitleYear
9,369,175'Low fabrication cost, high performance, high reliability chip scale package'20168,901,733'Reliable metal bumps on top of I/O pads after removal of test probe marks'20148,685,834'Fabrication method of package structure with simplified encapsulation structure and simplified wiring'20148,481,418'Low fabrication cost, high performance, high reliability chip scale package'20138,178,967'Low fabrication cost, high performance, high reliability chip scale package'20128,158,508'Structure and manufacturing method of a chip scale package'20127,902,679'Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump'20117,638,887'Package structure and fabrication method thereof'20097,465,653'Reliable metal bumps on top of I/O pads after removal of test probe marks'20087,355,288'Low fabrication cost, high performance, high reliability chip scale package'20087,338,890'Low fabrication cost, high performance, high reliability chip scale package'20087,105,920'Substrate design to improve chip package reliability'20066,917,119'Low fabrication cost, high performance, high reliability chip scale package'20056,815,324'Reliable metal bumps on top of I/O pads after removal of test probe marks'20046,642,136'Method of making a low fabrication cost, high performance, high reliability chip scale package'20036,075,281'Modified lead finger for wire bonding'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2016Based in Taichung, TW· patent location history
2008–2013Patents assigned to MEGICA CORP (7)· patent assignee history
2012–2016Patents assigned to LIN CHUEN-JYE (6)· patent assignee history
2012–2016Patents assigned to LEI MING-TA (5)· patent assignee history
2012–2016Patents assigned to HUANG CHING-CHENG (4)· patent assignee history
2012–2016Patents assigned to LEE JIN-YUAN (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MEGICA CORP | 7 | 2008–2013 |
| LIN CHUEN-JYEself | 6 | 2012–2016 |
| LEI MING-TA | 5 | 2012–2016 |
| HUANG CHING-CHENG | 4 | 2012–2016 |
| LEE JIN-YUAN | 3 | 2012–2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 16 | 2000–2016 |