Inventor

Remi Brechignac

Inventor

Grenoble, FR

Overview

18→

Patents

2001–2015

Patent span

Electricity

Primary field (CPC H)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation18%

H01LSemiconductor devices8%

H05KPrinted circuits8%

G02BOptical elements, systems or apparatus4%

G06KGraphical data reading4%

H04NPictorial communication, e.g. television4%

H10HInorganic light-emitting semiconductor devices having potential barriers4%

Y10TTechnical subjects covered by former us classification4%

B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%

PatentTitleYear

9,196,590'Perforated electronic package and method of fabrication'2015 9,136,292'Optical electronic package having a blind cavity for covering an optical sensor'2015 9,076,749'Electronic system comprising stacked electronic devices comprising integrated-circuit chips'2015 9,006,904'Dual side package on package'2015 8,482,116'Semiconductor device having stacked components'2013 7,326,968'Semiconductor packaging unit with sliding cage'2008 7,327,005'Optical semiconductor package with incorporated lens and shielding'2008 7,061,697'Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device'2006 7,012,331'Device for mounting a semiconductor package on a support plate via a base'2006 6,969,898'Optical semiconductor housing and method for making same'2005 6,893,169'Optical semiconductor package and process for fabricating the same'2005 6,870,238'Shielded housing for optical semiconductor component'2005 6,713,876'Optical semiconductor housing and method for making same'2004 6,696,006'Mold for flashless injection molding to encapsulate an integrated circuit chip'2004 6,597,020'Process for packaging a chip with sensors and semiconductor package containing such a chip'2003 6,374,486'Smart card and process for manufacturing the same'2002 6,312,975'Semiconductor package and method of manufacturing the same'2001 6,174,113'Method and apparatus for machining a cavity in a smart card'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001–2008Patents assigned to ST MICROELECTRONICS SA (12)· patent assignee history

2001–2015Based in Grenoble, FR· patent location history

2006–2013Patents assigned to ST MICROELECTRONICS SRL (2)· patent assignee history

2013–2015Patents assigned to ST MICROELECTRONICS GRENOBLE 2 (5)· patent assignee history

2013–2015Patents assigned to BRECHIGNAC REMI (2)· patent assignee history

2013–2015Patents assigned to COFFY ROMAIN (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
ST MICROELECTRONICS SA	12	2001–2008
ST MICROELECTRONICS GRENOBLE 2	5	2013–2015
BRECHIGNAC REMIself	2	2013–2015
COFFY ROMAIN	2	2013–2015
ST MICROELECTRONICS SRL	2	2006–2013

Locations

Location	Patents	Span
Grenoble, FR	18	2001–2015