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Inventor

Kai-Ping Huang

Inventor
Hinchu, TW

Overview

3→
Patents
2011–2020
Patent span
Physics
Primary field (CPC G)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G01Nprimary
G01NInvestigating or analysing materials by determining their chemical or physical properties14%
G05BControl or regulating systems in general14%
G06TImage data processing or generation, in general14%
H01LSemiconductor devices14%
H02HEmergency protective circuit arrangements14%
H10DInorganic electric semiconductor devices14%
Y02PClimate change mitigation technologies in the production or processing of goods14%
PatentTitleYear
10,840,237Electrostatic discharge protection circuit20208,666,140'Defect inspection method for wafer and wafer defect inspection system using the same'20147,899,635'Sampling inspection method'2011

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2011–2014Patents assigned to UNITED MICROELECTRONICS CORP (2)· patent assignee history
2011Based in Tainan, TW· patent location history
2014Patents assigned to HUANG KAI-PING (1)· patent assignee history
2014Based in Eastvale, SG· patent location history
2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2020Based in Hinchu, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
UNITED MICROELECTRONICS CORP22011–2014
HUANG KAI-PINGself12014
TAIWAN SEMICONDUCTOR MFG CO LTD12020
Locations
LocationPatentsSpan
Hinchu, TW12020
Eastvale, SG12014
Tainan, TW12011