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Inventor

JU HEON YANG

Inventor
KR

Overview

2→
Patents
2022–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices50%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
PatentTitleYear
12,568,829Packaging device including bumps and method of manufacturing the same202611,502,051Semiconductor chip including through electrode, and semiconductor package including the same2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2026Patents assigned to SK HYNIX INC (2)· patent assignee history
2022–2026Based in KR· patent location history
2026Patents assigned to SK HYNIC INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SK HYNIX INC22022–2026
SK HYNIC INC12026
Locations
LocationPatentsSpan
KR22022–2026