Inventor
YU-JEN CHENG
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
G06VImage or video recognition or understanding17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
G06KGraphical data reading6%
H02HEmergency protective circuit arrangements6%
H03KPulse technique6%
PatentTitleYear
12,394,242Fingerprint sensor device and method202512,237,288Semiconductor die package and method of manufacture202511,990,443Semiconductor die package and method of manufacture202411,727,714Fingerprint sensor device and method202311,194,990Fingerprint sensor device and method202111,146,056Interface control circuit and control method thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2021Patents assigned to RICHTEK TECHNOLOGY CORP (1)· patent assignee history
2021–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2021–2025 |
| RICHTEK TECHNOLOGY CORP | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2021–2025 |