Inventor
CHEE HAU NG
Inventor
SG
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10DInorganic electric semiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
12,324,168Semiconductor device and manufacturing method thereof202512,300,534Method of forming protective layer utilized in silicon remove process202512,080,622Semiconductor structure and method of wafer bonding202411,670,567Semiconductor structure and method of wafer bonding202311,398,548Semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to UNITED MICROELECTRONICS CORP (5)· patent assignee history
2022–2025Based in SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 5 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| SG | 5 | 2022–2025 |