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Inventor

Satoshi Wakabayashi

Inventor
Nirasaki, JP

Overview

32→
Patents
1990–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 32 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
B24BMachines, devices, or processes for grinding or polishing21%
C23CCoating metallic material12%
H10DInorganic electric semiconductor devices10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
H01LSemiconductor devices4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B08BCleaning in general1%
B24DTools for grinding, buffing or sharpening1%
B25JManipulators1%
PatentTitleYear
10,783,264Non-transitory computer-readable storage medium, and information processing device using unique file-specific information for decryption of a target file202010,242,878Substrate processing method and recording medium20199,620,370'Method of forming Ti film'20179,349,642'Method of forming contact layer'20168,263,181'Ti-based film forming method and storage medium'20128,257,790'Ti-containing film formation method and storage medium'2012D0660398'Fish hook'20127,981,794'Film forming method and substrate processing apparatus'20117,906,442'Gas treatment method and computer readable storage medium'20117,850,817'Polishing device and substrate processing device'20107,737,005'Method for forming Ti film and TiN film, contact structure, computer readable storing medium and computer program'20107,645,185'Substrate delivery mechanism'20107,632,378'Polishing apparatus'20097,514,120'Precoat film forming method'20097,160,180'Substrate delivery mechanism'20077,063,598'Substrate delivery mechanism'20066,916,231'Polishing apparatus'20056,878,044'Polishing apparatus'20056,682,408'Polishing apparatus'20046,609,962'Dressing apparatus and polishing apparatus'20036,602,119'Dressing apparatus'20036,578,891'Substrate holder and substrate transfer apparatus using the same'20036,390,901'Polishing apparatus'20026,379,229'Polishing apparatus'20026,358,128'Polishing apparatus'20026,358,131'Polishing apparatus'20026,358,126'Polishing apparatus'20026,354,922'Polishing apparatus'20026,069,093'Process of forming metal films and multi layer structure'20005,179,460'Input device having double-layer adhesive conductive connecting portions'19934,966,442'Electro-optical device and method for manufacturing same'19904,937,450'Infrared detector comprising an evacuated and cooled Dewar having an elliptical spheroid end window'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–1993Patents assigned to SEIKO EPSON CORP (2)· patent assignee history
2000–2019Patents assigned to TOKYO ELECTRON LTD (10)· patent assignee history
2000–2017Based in Nirasaki, JP· patent location history
2002–2010Patents assigned to EBARA CORP (17)· patent assignee history
2002–2010Based in Tokyo, JP· patent location history
2002–2010Based in Kanagawa, JP· patent location history
2002–2020Based in Yokohama, JP· patent location history
2012Patents assigned to WAKABAYASHI SATOSHI (3)· patent assignee history
2012Patents assigned to NARUSHIMA KENSAKU (2)· patent assignee history
2019Based in Yamanashi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EBARA CORP172002–2010
TOKYO ELECTRON LTD102000–2019
WAKABAYASHI SATOSHIself32012
NARUSHIMA KENSAKU22012
SEIKO EPSON CORP21990–1993
Locations
LocationPatentsSpan
Nirasaki, JP92000–2017
Tokyo, JP82002–2010
Kanagawa, JP72002–2010
Yokohama, JP22002–2020
Yamanashi, JP12019