Inventor
Joerg Busch
Inventor
Regensburg, DE
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1075%
H01LSemiconductor devices25%
PatentTitleYear
8,765,531'Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement'20147,737,560'Metallization layer for a power semiconductor device'20107,276,803'Semiconductor component and method for fabricating'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2014Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history
2007–2014Based in Regensburg, DE· patent location history
2010Patents assigned to INFINEON TECHNOLOGIES AUSTRIA (1)· patent assignee history
2014Patents assigned to BUSCH JOERG (1)· patent assignee history
2014Patents assigned to GATTERBAUER JOHANN (1)· patent assignee history
2014Patents assigned to WEIDGANS BERNHARD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 2 | 2007–2014 |
| BUSCH JOERGself | 1 | 2014 |
| GATTERBAUER JOHANN | 1 | 2014 |
| INFINEON TECHNOLOGIES AUSTRIA | 1 | 2010 |
| WEIDGANS BERNHARD | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Regensburg, DE | 3 | 2007–2014 |