Inventor
Max L. Lifson
Inventor
South Burlington, VT, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
B82YSpecific uses or applications of nanostructures13%
H10DInorganic electric semiconductor devices13%
G01BMeasuring length, thickness or similar linear dimensions4%
G01SRadio direction-finding4%
Y10TTechnical subjects covered by former us classification4%
G01FMeasuring volume, volume flow, mass flow or liquid level1%
PatentTitleYear
11,081,572Integrated circuit heat dissipation using nanostructures202110,629,710Integrated circuit heat dissipation using nanostructures202010,600,893Integrated circuit heat dissipation using nanostructures202010,224,225Centering substrates on a chuck201910,109,553Integrated circuit heat dissipation using nanostructures201810,068,827Integrated circuit heat dissipation using nanostructures20189,997,385Centering substrates on a chuck20189,704,978'Integrated circuit heat dissipation using nanostructures'20179,685,362'Apparatus and method for centering substrates on a chuck'20179,666,701'Integrated circuit heat dissipation using nanostructures'20179,607,929'Tsv wafer with improved fracture strength'20179,601,606'Integrated circuit heat dissipation using nanostructures'20179,508,578'Method and apparatus for detecting foreign material on a chuck'20169,324,628'Integrated circuit heat dissipation using nanostructures'20169,312,205'Methods of forming a TSV wafer with improved fracture strength'20169,275,868'Uniform roughness on backside of a wafer'2016Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2016–2021Patents assigned to IBM (15)· patent assignee history
2016Patents assigned to GLOBALFOUNDRIES INC (2)· patent assignee history
2016–2021Based in South Burlington, VT, US· patent location history
2016Based in Burlington, VT, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 15 | 2016–2021 |
| GLOBALFOUNDRIES INC | 2 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| South Burlington, VT, US | 15 | 2016–2021 |
| Burlington, VT, US | 1 | 2016 |