LexDanaLexDanabeta
Inventor

JHENG-SI SU

Inventor
TW

Overview

5→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices26%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
B24BMachines, devices, or processes for grinding or polishing21%
B25JManipulators5%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors5%
H10DInorganic electric semiconductor devices5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
PatentTitleYear
12,255,150CMP safe alignment mark202512,076,831Chemical mechanical polishing apparatus and method202411,673,223Chemical mechanical polishing method202311,292,101Chemical mechanical polishing apparatus and method202211,251,063Article transporter in semiconductor fabrication2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2022–2025Based in TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD52022–2025
Locations
LocationPatentsSpan
TW52022–2025