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Inventor

Chih-Ming Kuo

Inventor
Hsinchu County, TW

Overview

28→
Patents
2000–2016
Patent span
Electricity
Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H01FMagnets8%
H01LSemiconductor devices8%
H05KPrinted circuits8%
Y10TTechnical subjects covered by former us classification8%
H10DInorganic electric semiconductor devices7%
H10KOrganic electric solid-state devices7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
C23CCoating metallic material3%
PatentTitleYear
9,496,417'Non-volatile memory cell'20169,159,660'Semiconductor package structure and method for making the same'20159,059,260'Semiconductor manufacturing method and semiconductor structure thereof'20158,982,641'Memory erasing method and driving circuit thereof'20158,963,675'Method for fabricating a carrier with a three dimensional inductor and structure thereof'20158,953,309'Electronic device'20158,841,767'Bumping process and structure thereof'20148,823,169'Semiconductor manufacturing method and semiconductor structure thereof'20148,772,644'Carrier with three-dimensional capacitor'20148,704,345'Semiconductor package and lead frame thereof'20148,692,390'Pyramid bump structure'20148,658,528'Bumping process and structure thereof'20148,658,466'Semiconductor package structure and method for making the same'20148,633,744'Power reset circuit with zero standby current consumption'20148,581,384'Semiconductor package structure'20138,513,772'Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof'20138,450,049'Process for forming an anti-oxidant metal layer on an electronic device'20138,450,203'Bumping process and structure thereof'20138,432,017'Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof'20138,415,243'Bumping process and structure thereof'20138,347,490'Method for fabricating a carrier with a three dimensional inductor'20136,963,214'OBIRCH dual power circuit'20056,957,995'Apparatus for repairing organic electroluminescent element defects'20056,753,195'Method of repairing organic light-emitting element pixels'20046,658,762'Method and apparatus for transporting substrates in OLED process'20036,393,716'Method and apparatus for transporting substrates in OLED process'20026,183,606'Manufacture method of high coercivity FePt-Si3N4 granular composite thin films'20016,117,282'Method of producing amorphous Co-Tb magnetic recording thin films'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2015Based in Taipei, TW· patent location history
2002–2003Based in Hsin Chu Industrial Park, TW· patent location history
2005–2016Based in Hsinchu, TW· patent location history
2013–2015Patents assigned to CHIPBOND TECHNOLOGY CORP (17)· patent assignee history
2013–2015Patents assigned to KUO CHIH-MING (11)· patent assignee history
2013–2014Patents assigned to HO LUNG-HUA (6)· patent assignee history
2013–2014Patents assigned to HSIEH CHIN-TANG (4)· patent assignee history
2013–2014Patents assigned to CHANG SHIH-CHIEH (3)· patent assignee history
2013–2015Based in Hsinchu County, TW· patent location history
2014–2015Based in Jhubei City, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP172013–2015
KUO CHIH-MINGself112013–2015
HO LUNG-HUA62013–2014
HSIEH CHIN-TANG42013–2014
CHANG SHIH-CHIEH32013–2014
Locations
LocationPatentsSpan
Hsinchu County, TW162013–2015
Taipei, TW42000–2015
Hsinchu, TW32005–2016
Jhubei City, TW22014–2015
Hsin Chu Industrial Park, TW22002–2003