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Inventor

Rahim KASIM

Inventor
US

Overview

3→
Patents
2021–2024
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices30%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
C23CCoating metallic material10%
C25DProcesses for the electrolytic or electrophoretic production of coatings10%
PatentTitleYear
12,176,214Selective metal removal for conductive interconnects in integrated circuitry202411,749,560Cladded metal interconnects202311,158,515Selective metal removal for conductive interconnects in integrated circuitry2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2024Patents assigned to INTEL CORP (3)· patent assignee history
2021–2024Based in US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP32021–2024
Locations
LocationPatentsSpan
US32021–2024