Inventor
James L. Carper
Inventor
Colchester, VT, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
B23KSoldering or unsoldering9%
B23PMetal-working not otherwise provided for9%
F01DNon-positive displacement machines or engines, e.g. steam turbines9%
F02CGas-turbine plants9%
F05DIndexing scheme for aspects relating to non-positive-displacement machines or engines, gas-turbines or jet-propulsion plants9%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact9%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application9%
Y02TClimate change mitigation technologies related to transportation9%
PatentTitleYear
11,054,197Heat exchanger and methods of forming20216,603,195'Planarized plastic package modules for integrated circuits'20035,776,801'Leadframe having contact pads defined by a polymer insulating film'19985,608,260'Leadframe having contact pads defined by a polymer insulating film'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2003Patents assigned to IBM (3)· patent assignee history
1997–2003Based in Colchester, VT, US· patent location history
2021Patents assigned to UNISON IND LLC (1)· patent assignee history
2021Based in Kettering, OH, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 3 | 1997–2003 |
| UNISON IND LLC | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Colchester, VT, US | 3 | 1997–2003 |
| Kettering, OH, US | 1 | 2021 |