Inventor
Wen-Liang Tseng
Inventor
Hsinchu, TW
Overview
Patents· 63 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H01LSemiconductor devices13%
F21VFunctional features or details of lighting devices or systems thereof6%
LOC135%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted4%
H10DInorganic electric semiconductor devices4%
F21KNon-electric light sources using luminescence3%
G02BOptical elements, systems or apparatus3%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein1%
PatentTitleYear
10,705,376Liquid crystal display device202010,510,931Side-view light emitting diode package structure201910,222,024Lens for light emitting device201910,133,133Liquid crystal display base20189,992,566Wireless joint and wireless microphone having same20189,899,587'Lead frame and light emitting diode package having the same'20189,842,968'LED package'20179,786,642'Light emitting diode package substrate and light emitting diode package element'20179,746,162'Light emitting diode bulb'2017D0791742'Wireless head for microphone'20179,660,144'LED package and LED die'20179,620,692'Lead frame and light emitting diode package having the same'20179,543,486'LED package with reflecting cup'20179,465,205'Optical lens and backlight module incorporating the same'20169,431,591'LED package with reflecting cup'20169,184,358'Lead frame and light emitting diode package having the same'20159,041,022'Light emitting diode package and method for manufacturing the same'20159,012,248'Method for packaging light emitting diode'20158,979,312'Light emitting diode bulb'20158,960,955'LED lamp having a large illumination angle'20158,956,893'Metiod of making LED with bat-wing emitting field lens'20158,921,131'Method for manufacturing light emitting diode package'20148,906,715'Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same'20148,853,733'Light emitting diode package and method for manufacturing the same'20148,828,755'Light-emitting element package and fabrication method thereof'20148,816,372'LED package having a covering portion made of silicon-titanate resin for sealing a joint and method for making the same'20148,809,083'Method of manufacturing light emitting diode'20148,791,493'Light emitting diode package and method for manufacturing the same'20148,772,062'Method for manufacturing light emitting diode package having LED die fixed by anisotropic conductive paste'20148,687,796'Method and electronic device for improving communication quality based on ambient noise sensing'20148,664,018'Manufacturing method for LED package'20148,658,445'Method for manufacturing phosphor film and method for making LED package having the phosphor film'20148,657,469'Traffic light assembly'20148,551,794'LED package and mold of manufacturing the same'20138,541,799'Light-emitting element package and fabrication method thereof'20138,476,664'Light emitting diode package having multiple luminescent conversion layers'20138,470,621'Method for fabricating a flip-chip semiconductor optoelectronic device'20138,459,838'Traffic light'20138,455,275'Method for making light emitting diode package'20138,455,274'Method for manufacturing light emitting diode'20138,384,276'LED lamp structure'20138,378,378'Light emitting diode package and method of fabricating the same'20138,344,406'Light emitting diode package and manufacturing method thereof'20138,270,444'Side emitting semiconductor package'20128,242,519'Package structure of light emitting diode for backlight'2012D0654444'LED module'2012D0644189'LED light bar'2011D0642994'LED light bar'2011D0642998'LED module'2011D0642995'LED light bar'20117,994,628'Package structure of photoelectronic device and fabricating method thereof'20117,989,237'Package structure for solid-state lighting devices and method of fabricating the same'2011D0642545'LED light bar'2011D0640212'LED light bar'20117,855,390'Package structure of light emitting diode for backlight'20107,719,099'Package structure for solid-state lighting devices and method of fabricating the same'20107,508,007'Package structure of light-emitting diode'20097,031,854'Universal power measurement SoC and measuring method'20066,686,218'Method for packaging a high efficiency electro-optics device'20046,603,151'Method and structure for packaging a high efficiency electro-optics device'20036,577,191'Automatic gain control circuit for analog signals'20036,445,008'Photo sensing device and the manufacturing method thereof'20025,229,699'Method and an apparatus for PID controller tuning'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2020Based in Hsinchu, TW· patent location history
2003–2012Based in Taipei, TW· patent location history
2009–2020Patents assigned to ADVANCED OPTOELECTRONIC TECH (50)· patent assignee history
2012–2015Patents assigned to TSENG WEN-LIANG (16)· patent assignee history
2012–2015Patents assigned to CHEN LUNG-HSIN (9)· patent assignee history
2012–2013Patents assigned to HSIEH MIN-TSUN (6)· patent assignee history
2012–2013Patents assigned to LIN CHIH-YUNG (6)· patent assignee history
2013Based in Hsinchu County, TW· patent location history
2014Based in Taoyuan, TW· patent location history
2017–2018Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED OPTOELECTRONIC TECH | 50 | 2009–2020 |
| TSENG WEN-LIANGself | 16 | 2012–2015 |
| CHEN LUNG-HSIN | 9 | 2012–2015 |
| HSIEH MIN-TSUN | 6 | 2012–2013 |
| LIN CHIH-YUNG | 6 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 50 | 2002–2020 |
| Taipei, TW | 8 | 2003–2012 |
| New Taipei, TW | 2 | 2017–2018 |
| Taoyuan, TW | 1 | 2014 |
| Hsinchu County, TW | 1 | 2013 |