Inventor
Leon L. Wu
Inventor
Hopewell Junction, NY, US
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
G06FElectric digital data processing10%
Y10TTechnical subjects covered by former us classification8%
G06NComputing arrangements based on specific computational models6%
G11CStatic stores6%
H03KPulse technique6%
H05KPrinted circuits6%
H10DInorganic electric semiconductor devices6%
B41JTypewriters4%
G01RMeasuring electric variables2%
PatentTitleYear
10,699,218Energy analytics learning machine202010,430,725Petroleum analytics learning machine system with machine learning analytics applications for upstream and midstream oil and gas industry20198,942,384'Dual-mode headset'20158,751,421'Machine learning for power grid'20148,725,665'Metrics monitoring and financial validation system (M2FVS) for tracking performance of capital, operations, and maintenance investments to an infrastructure'20148,715,009'Edge connector'20148,586,873'Test point design for a high speed bus'20137,106,094'Method and topology for improving signal quality on high speed, multi-drop busses'20067,089,440'Skew compensation for a multi-agent shared bus'20066,900,664'Method and system for intelligent bi-direction signal net with dynamically configurable input/output cell'20056,864,018'Battery with a controlled release anode'20056,845,436'Synchronized signal transfer system'20056,661,859'Synchronizer for a source synchronized clock bus with multiple agents'20036,162,659'Method for manufacturing a package structure having a heat spreader for integrated circuit chips'20006,104,629'High frequency memory module'20006,105,144'System and method for alleviating skew in a bus'20005,828,259'Method and apparatus for reducing disturbances on an integrated circuit'19985,777,385'Ceramic ball grid array (CBGA) package structure having a heat spreader for integrated-circuit chips'19985,754,399'Direct coupled CPU package'19985,397,747'Vertical chip mount memory package and method'19955,365,204'CMOS voltage controlled ring oscillator'19945,362,986'Vertical chip mount memory package with packaging substrate and memory chip pairs'19945,294,754'Direct write EC single metal layer'19945,060,116'Electronics system with direct write engineering change capability'19914,803,595'Interposer chip technique for making engineering changes between interconnected semiconductor chips'19894,688,151'Multilayered interposer board for powering high current chip modules'19874,553,050'Transmission line terminator-decoupling capacitor chip for off-chip driver'19854,535,388'High density wired module'19854,274,124'Thick film capacitor having very low internal inductance'19814,035,607'Integrated heater element array'19773,969,670'Electron beam testing of integrated circuits'19763,953,264'Integrated heater element array and fabrication method'1976Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1976–2006Patents assigned to IBM (23)· patent assignee history
1976–1998Based in Hopewell Junction, NY, US· patent location history
1998–2006Based in Austin, TX, US· patent location history
2013–2015Patents assigned to WU LEON (4)· patent assignee history
2014Patents assigned to UNIV COLUMBIA (2)· patent assignee history
2014Patents assigned to ANDERSON ROGER N (1)· patent assignee history
2014–2020Based in New York, NY, US· patent location history
2014Based in Taoyuan, TW· patent location history
2015Based in Suzhou, CN· patent location history
2019–2020Patents assigned to AKW ANALYTICS INC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 23 | 1976–2006 |
| WU LEONself | 4 | 2013–2015 |
| AKW ANALYTICS INC | 2 | 2019–2020 |
| UNIV COLUMBIA | 2 | 2014 |
| ANDERSON ROGER N | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hopewell Junction, New York, US | 14 | 1976–1998 |
| Austin, Texas, US | 9 | 1998–2006 |
| New York, New York, US | 4 | 2014–2020 |
| Suzhou, CN | 1 | 2015 |
| Taoyuan, TW | 1 | 2014 |