Inventor
CURTIS TSAI
Inventor
US
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Dprimary
H10DInorganic electric semiconductor devices42%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B82YSpecific uses or applications of nanostructures8%
H10BElectronic memory devices4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
PatentTitleYear
12,568,643Nanowire transistors and methods of fabrication202612,520,578Methods of integrating multiple gate dielectric transistors on a tri-gate (finfet) process202612,471,354Dipole threshold voltage tuning for high voltage transistor stacks202512,317,590Substrate-free integrated circuit structures202512,166,031Substrate-less electrostatic discharge (ESD) integrated circuit structures202412,136,628High voltage three-dimensional devices having dielectric liners202411,881,486High voltage three-dimensional devices having dielectric liners202411,695,008Methods of integrating multiple gate dielectric transistors on a tri-gate (FINFET) process202311,610,917High voltage three-dimensional devices having dielectric liners202311,251,201High voltage three-dimensional devices having dielectric liners2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to INTEL CORP (10)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 10 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 10 | 2022–2026 |