Inventor
Michael Wozniak
Inventor
Vestal, NY, US
Overview
Patents· 22 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits38%
Y10TTechnical subjects covered by former us classification21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
C23FNon-mechanical removal of metallic material from surface8%
B24BMachines, devices, or processes for grinding or polishing6%
D21GCalenders2%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure2%
PatentTitleYear
8,242,376'Circuitized substrates utilizing smooth-sided conductive layers as part thereof'20127,838,776'Circuitized substrates utilizing smooth-sided conductive layers as part thereof'20107,383,629'Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof'20087,169,313'Plating method for circuitized substrates'20076,845,557'Method for producing an electronic package possessing controlled impedance characteristics'20056,776,852'Process of removing holefill residue from a metallic surface of an electronic substrate'20046,630,743'Copper plated PTH barrels and methods for fabricating'20036,618,940'Fine pitch circuitization with filled plated through holes'20036,547,974'Method of producing fine-line circuit boards using chemical polishing'20036,537,608'Protection of a plated through hole from chemical attack'20036,467,160'Fine pitch circuitization with unfilled plated through holes'20026,469,256'Structure for high speed printed wiring boards with multiple differential impedance-controlled layers'20026,291,779'Fine pitch circuitization with filled plated through holes'20016,264,851'Selective seed and plate using permanent resist'20016,241,138'Paper web threading apparatus and method for threading a paper web through a papermaking machine'20016,221,694'Method of making a circuitized substrate with an aperture'20016,188,027'Protection of a plated through hole from chemical attack'20016,093,335'Method of surface finishes for eliminating surface irregularities and defects'20005,893,983'Technique for removing defects from a layer of metal'19995,759,427'Method and apparatus for polishing metal surfaces'19985,705,757'Apparatus and method for measuring torque and power'19985,489,500'Flexible strip structure for a parallel processor and method of fabricating the flexible strip'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2005Patents assigned to IBM (16)· patent assignee history
1996–2012Based in Vestal, NY, US· patent location history
1998–2001Patents assigned to LAWTON C A (2)· patent assignee history
1998–2001Based in De Pere, WI, US· patent location history
2007–2012Patents assigned to ENDICOTT INTERCONNECT TECH INC (4)· patent assignee history
2012Patents assigned to LAUFFER JOHN M (1)· patent assignee history
2012Patents assigned to MARKOVICH VOYA R (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 16 | 1996–2005 |
| ENDICOTT INTERCONNECT TECH INC | 4 | 2007–2012 |
| LAWTON C A | 2 | 1998–2001 |
| LAUFFER JOHN M | 1 | 2012 |
| MARKOVICH VOYA R | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Vestal, New York, US | 20 | 1996–2012 |
| De Pere, WI, US | 2 | 1998–2001 |