Inventor
Wei Wang
Inventor
Beijing, CN
Overview
Patents· 26 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices6%
C02FTreatment of water, waste water, sewage, or sludge4%
G01NInvestigating or analysing materials by determining their chemical or physical properties4%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes4%
H10BElectronic memory devices4%
H10NElectric solid-state devices not otherwise provided for4%
A61KPreparations for medical, dental or toiletry purposes3%
B01DSeparation3%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry3%
B82YSpecific uses or applications of nanostructures3%
PatentTitleYear
11,123,670Method for preparing simultaneous nitrogen and phosphorus removal lightweight material and the use thereof202111,063,216Confined phase change memory with double air gap202111,005,752Packet transmission202110,888,408Packaging for dry tissue prosthetic heart valve202110,833,2693D phase change memory202010,773,437Mold of in-mold molding and ejecting mechanism thereof202010,615,257Patterning method for nanosheet transistors202010,604,599Method for green synthesis of uniform- and large-particle-size polystyrene particles202010,517,961Drug formulation based on particulates comprising polysaccharide-vitamin conjugate201910,505,111Confined phase change memory with double air gap201910,392,742Biofinishing system201910,346,176Mainframe system structuring201910,247,642Portable efficient magnetic solid phase extraction device and extraction method thereof201910,010,862Hydrophilic magnetic resin with high specific area, preparation method therefor and application method thereof for rapidly extracting phthalates in water body20189,890,934'LED lamp bead wire clamping mounting structure'20189,828,662Low cost and high strength titanium alloy and heat treatment process20179,213,546'Implementation of instruction for direct memory copy'20158,682,808'Method and apparatus for processing logistic information'20148,571,908'Allocating commodity shelves in a supermarket'20138,494,823'Method and system for determining service area of supply chain by simulating service cycle time'20137,727,508'Process for preparing powder of niobium suboxides or niobium'20107,573,024'Flexible bioelectronic photodetector and imaging arrays based on bacteriorhodopsin (BR) thin films'20097,556,967'Foldable polymers as probes'20097,435,847'Preparation of solid ammonium glyphosate using organic solvent in extraction'20087,371,364'Cyclic peptide and imaging compound compositions and uses for targeted imaging and therapy'20087,238,792'Foldable polymers as probes'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2009Based in Pullman, WA, US· patent location history
2013–2021Patents assigned to IBM (9)· patent assignee history
2013–2014Patents assigned to DING HONG WEI (3)· patent assignee history
2013–2014Patents assigned to DONG JIN (3)· patent assignee history
2013–2014Patents assigned to WANG WEI (3)· patent assignee history
2013–2021Based in Beijing, CN· patent location history
2018–2021Patents assigned to NANJING UNIVERSITY OF TECHNOLOGY (4)· patent assignee history
2019–2021Based in Yorktown Heights, NY, US· patent location history
2019–2021Based in Nanjing, CN· patent location history
2021Based in Garden Grove, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 9 | 2013–2021 |
| NANJING UNIVERSITY OF TECHNOLOGY | 4 | 2018–2021 |
| DING HONG WEI | 3 | 2013–2014 |
| DONG JIN | 3 | 2013–2014 |
| WANG WEIself | 3 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beijing, CN | 7 | 2013–2021 |
| Yorktown Heights, New York, US | 4 | 2019–2021 |
| Nanjing, CN | 3 | 2019–2021 |
| Pullman, Washington, US | 2 | 2007–2009 |
| Garden Grove, California, US | 1 | 2021 |