Inventor
Paul Goodwin
Inventor
Austin, TX, US
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits34%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
G11CStatic stores19%
G06FElectric digital data processing11%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
E04GScaffolding3%
G01RMeasuring electric variables3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
7,768,796'Die module system'20107,760,513'Modified core for circuit module system and method'20107,737,549'Circuit module with thermal casing systems'20107,626,259'Heat sink for a high capacity thin module system'20097,616,452'Flex circuit constructions for high capacity circuit module systems and methods'20097,606,042'High capacity thin module system and method'20097,606,050'Compact module system and method'20097,606,049'Module thermal management system and method'20097,606,040'Memory module system and method'20097,602,613'Thin module system and method'20097,579,687'Circuit module turbulence enhancement systems and methods'20097,542,297'Optimized mounting area circuit module system and method'20097,539,582'Apparatus and method for detecting and analyzing spectral components in predetermined frequency bands within a signal, frequency filter, and related computer-readable media'20097,522,425'High capacity thin module system and method'20097,511,968'Buffered thin module system and method'20097,480,152'Thin module system and method'20097,474,973'Apparatus and method for detecting and analyzing spectral components in predetermined frequency bands within a signal, frequency filter, and related computer-readable media'20097,468,553'Stackable micropackages and stacked modules'20087,468,893'Thin module system and method'20087,459,784'High capacity thin module system'20087,446,410'Circuit module with thermal casing systems'20087,443,023'High capacity thin module system'20087,423,885'Die module system'20087,324,352'High capacity thin module system and method'20087,309,914'Inverted CSP stacking system and method'20077,289,327'Active cooling methods and apparatus for modules'20074,876,054'Concrete forming method'19894,595,168'Plastic lined paper form for casting concrete columns'19864,490,314'Radiation cured silicone rubber articles'19844,362,674'Process for making radiation cured silicone rubber articles'1982Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1982–1984Patents assigned to HIGH VOLTAGE ENGINEERING CORP (2)· patent assignee history
1982–1984Based in Amherst, NH, US· patent location history
1986–1989Patents assigned to PERMA TUBES LTD (2)· patent assignee history
1986–1989Based in Mississauga, CA· patent location history
2007–2008Patents assigned to STAKTEK GROUP LP (3)· patent assignee history
2007–2010Based in Austin, TX, US· patent location history
2008–2010Patents assigned to ENTORIAN TECHNOLOGIES LP (20)· patent assignee history
2009Based in Anchorage, AK, US· patent location history
2010Patents assigned to ENTORIAN TECHNOLOGIES L P (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ENTORIAN TECHNOLOGIES LP | 20 | 2008–2010 |
| STAKTEK GROUP LP | 3 | 2007–2008 |
| HIGH VOLTAGE ENGINEERING CORP | 2 | 1982–1984 |
| PERMA TUBES LTD | 2 | 1986–1989 |
| ENTORIAN TECHNOLOGIES L P | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Austin, Texas, US | 24 | 2007–2010 |
| Anchorage, AK, US | 2 | 2009 |
| Mississauga, CA | 2 | 1986–1989 |
| Amherst, NH, US | 2 | 1982–1984 |